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Zou Yang, Guo Bo, Duan Xuejun, Wu Qingtang, Wei Wei, Wu Huan. Research progress on reliability of lead-free soldered joints[J]. WELDING & JOINING, 2021, (8): 41-48. DOI: 10.12073/j.hj.20210521003
Citation: Zou Yang, Guo Bo, Duan Xuejun, Wu Qingtang, Wei Wei, Wu Huan. Research progress on reliability of lead-free soldered joints[J]. WELDING & JOINING, 2021, (8): 41-48. DOI: 10.12073/j.hj.20210521003
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Research progress on reliability of lead-free soldered joints

  • Changchun Equipment & Technology Research Institute, Changchun 130012, China

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  • Received Date: May 20, 2021
  • Available Online: June 10, 2024
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    • Abstract
  • Based on the problems existing in the research and development of lead-free solders in China in recent two years, research progress and development trend of lead-free solders was briefly reviewed in this paper, and the lead-free solders focusing on the reliability of soldered joints was reviewed. Factors affecting the reliability of lead-free solder joints were firstly introduced in this paper. Research methods and achievements of domestic scholars on the reliability of lead-free solder joints from 2012 ～ 2018 year were secondly collected. Reliability of leadfree soldered joints was analyzed from four aspects that affected performance of lead-free soldered, namely joints loading and thermal cycling,finite element simulation, electrical migration and tin whisker growth. Based on the above research results, the future development of lead-free solders was finally prospected, which provided theoretical support for further research of new lead-free solders.
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    • References (48)
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