| Citation: |
PEI Chong, CHEN Hao, QIU Jiayu, et al. Microstructure and mechanical properties of IC10 alloy brazed joints by B-Ni55NbCoWCrAlSiMo(C)-S brazing filler metal[J]. Welding & Joining, 2025（5）：27 − 31. DOI: 10.12073/j.hj.20240930003
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[Objective] The aim was to study microstructure and mechanical properties of IC10 alloy brazed joints by B-Ni55NbCoWCrAlSiMo(C)-S brazing filler metal (B-Ni55 brazing filler metal). [Methods] Brazing experiments of IC10 superalloy were conducted by B-Ni55 brazing filler metal at brazing temperature of 1 225 ℃ for 30 min with different clearances, and microstructure and mechanical properties of brazed joints were analyzed. [Results] The results indicated that a strong interfacial reaction occurred between brazing filler metal and base metal during the brazing process. Complete brazed joints could still be formed even with a large clearance of 1.6 mm. [Conclusion] The average stress rupture life of brazed joints obtained at a clearance of 0.05 mm was 99.5 h under the condition of 980 ℃/75 MPa, and rupture life showed a decreasing trend with the increase of brazing clearance.
| [1] |
万娣, 房卫萍, 陈和兴, 等. B含量对IC10合金TLP焊接用中间层材料及接头组织的影响[J]. 焊接, 2016(6): 35 − 39. doi: 10.3969/j.issn.1001-1382.2016.06.011
WAN D, FANG W P, CHEN H X, et al. Influence of boron-addition on microstructure of interlayer alloys and TLP bonded IC10 superalloy joints[J]. Welding & Joining, 2016(6): 35 − 39. doi: 10.3969/j.issn.1001-1382.2016.06.011
|
| [2] |
郎波, 侯金保, 吴松. IC10单晶过渡液相扩散焊接头微观组织与力学性能[J]. 焊接学报, 2012, 33(8): 109 − 112.
LANG B, HOU J B, WU S. Microstructure and mechanical properties of IC10 single crystal superalloy transient liquid phase diffusion bonding joint[J]. Transactions of the China Welding Institution, 2012, 33(8): 109 − 112.
|
| [3] |
侯金保, 张蕾, 魏友辉. ICl0合金TLP扩散焊接头组织与强度分析[J]. 焊接学报, 2008, 29(3): 89 − 92. doi: 10.3321/j.issn:0253-360X.2008.03.023
HOU J B, ZHANG L, WEI Y H. Microstructure and strength analysis of IC10 alloy TLP-DB joint[J]. Transactions of the China Welding Institution, 2008, 29(3): 89 − 92. doi: 10.3321/j.issn:0253-360X.2008.03.023
|
| [4] |
叶雷, 李晓红, 毛唯, 等. 不同中间层合金对IC10合金的连接[J]. 航空材料学报, 2006, 26(3): 319 − 320. doi: 10.3969/j.issn.1005-5053.2006.03.073
YE L, LI X H, MAO W, et al. Bonding of IC10 alloy with different interlayer alloys[J]. Journal of Aeronautical Materials, 2006, 26(3): 319 − 320. doi: 10.3969/j.issn.1005-5053.2006.03.073
|
| [5] |
李菊, 侯金保, 张胜, 等. IC10合金TLP扩散焊接头拉伸性能研究[J]. 焊接, 2015(6): 22 − 26. doi: 10.3969/j.issn.1001-1382.2015.06.008
LI J, HOU J B, ZHANG S, et al. Tensile properties of TLP butt joint for IC10 alloy[J]. Welding & Joining, 2015(6): 22 − 26. doi: 10.3969/j.issn.1001-1382.2015.06.008
|
| [6] |
曹健, 宋晓国, 郑祖金, 等. 扩散时间对DD6单晶高温合金TLP接头界面组织的影响[J]. 焊接学报, 2011, 32(7): 13 − 16.
CAO J, SONG X G, ZHENG Z J, et al. Effect of diffusion time on interfacial microstructure of TLP joints of DD6 single crystal superalloy[J]. Transactions of the China Welding Institution, 2011, 32(7): 13 − 16.
|
| [7] |
郎波, 侯金保, 吴松. DD32单晶高温合金过渡液相扩散连接[J]. 材料工程, 2010(10): 32 − 37. doi: 10.3969/j.issn.1001-4381.2010.10.008
LANG B, HOU J B, WU S. Transient liquid phase diffusion bonding of DD32 single crystal superalloy[J]. Journal of Materials Engineering, 2010(10): 32 − 37. doi: 10.3969/j.issn.1001-4381.2010.10.008
|
| [8] |
柴禄, 侯金保, 张胜. 工艺参数对IC10单晶TLP接头组织和性能的影响[J]. 焊接学报, 2018, 39(8): 114 − 118. doi: 10.12073/j.hjxb.2018390212
CHAI L, HOU J B, ZHANG S. Influence of process parameters on microstructure and properties of IC10 single crystal TLP joints[J]. Transactions of the China Welding Institution, 2018, 39(8): 114 − 118. doi: 10.12073/j.hjxb.2018390212
|
| [9] |
叶雷, 毛唯, 谢永慧, 等. 定向凝固高温合金IC10瞬态液相(TLP)扩散焊接头组织研究[J]. 材料工程, 2004(3): 42 − 44. doi: 10.3969/j.issn.1001-4381.2004.03.012
YE L, MAO W, XIE Y H. Research on TLP diffusion bonded joint microstructure of directionally solidfied superalloy IC10[J]. Journal of Materials Engineering, 2004(3): 42 − 44. doi: 10.3969/j.issn.1001-4381.2004.03.012
|
| [10] |
薛青, 李扬, 刘振波, 等. IC10/BNi2/GH3039TLP扩散焊接头的微观组织及力学性能分析[J]. 航天制造技术, 2015(4): 5 − 9.
XUE Q, LI Y, LIU Z B, et al. Research on microstructure and mechanical properties of tlp bonded joint of IC10/BNi2/GH3039[J]. Aerospace Manufacturing Technology, 2015(4): 5 − 9.
|
| [11] |
李琪, 刘凤美, 乐雄, 等. 热处理对80 μm间隙下IC10高温合金TLP扩散焊组织及高温性能的影响[J]. 焊接学报, 2021, 42(5): 36 − 44. doi: 10.12073/j.hjxb.20201209003
LI Q, LIU F M, YUE X, et al. Effect of heat treatment on microstructure and high temperature properties of IC10 superalloy TLP diffusion welding under 80 μm gap[J]. Transactions of the China Welding Institution, 2021, 42(5): 36 − 44. doi: 10.12073/j.hjxb.20201209003
|
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