Abstract: To verify the melting condition of CuSnTi-_8-5 solder paste, the same welding process of the solder foil could be used, and properties of soldered joints with solder paste were not lower than that of soldered joint with solder foil. Differential thermal analysis (DSC), weltability test and mechanical properties of the joint were tested. he microstructure of the joint was analyzed by scanning electron microscope (SEM) and energy dispersive spectrometer (EDS).The related properties of solder paste and solder foil were compared. The results showed that CuSnTi-_8-5 solder paste had a close solidliquid temperature to the solder foil, which fully met the welding process of the solder foil. The weltability and spreadability of the solder paste was better than that of the solder foil, and the strength of the soldered joint with the solder paste was higher than that of the soldered joint with the solder foil. The reason was that under the same soldering temperature, the solder paste had a longer interaction time with the substrate, which obtained more weting kinetic energy, so it preented a higher spreading coelficient. In addition, the solder foil could not form obvious weting fillet around the weld as the solder paste did, which afected mechanical properties of the soldered joint. Through analysis of microstructure, the dierence in wetability and mechanical properties of the soldered joints was due to the dillerent state of Cu-Ti solid solution formed between soldering seams with the solder paste and the solder foil and the base metal.