Cu/GH4099钎焊接头组织及力学性能

Microstructure and properties of Cu and GH4099 vacuum brazed joints

  • 摘要: 采用Ti-Zr-Ni-Cu钎料实现了镍基合金GH4099和T2紫铜的真空钎焊,分析了不同工艺参数对接头抗拉强度的影响,并借助扫描电镜(SEM)、能谱分析(EDS)和X射线衍射分析等方法研究了钎焊接头界面组织,确定了界面反应产物及其形态分布。研究结果表明,钎缝中主要是金属间化合物生成相,如Cu-Ti,Ni-Ti,Cu-Ni-Ti系等。在试验条件下,随着钎焊温度和加热时间的增加,接头抗拉强度呈现先增大再降低的趋势,当钎焊温度为930℃和保温时间为10 min时,获得最大抗拉强度为182 MPa的钎焊接头。

     

    Abstract: GH4099 and pure copper was brazed with Ti-Zr-Ni-Cu filler metal by vacuum brazing. In vacuum brazing process,effects of process parameters on tensile strength of joints were investigated. Microstructure of the brazed joint with Ti-Zr-Ni-Cu filler metal was studied by means of scanning electron microscopy( SEM),Energy Dispersive Spectroscopy( EDS) and X-ray diffraction( XRD). The results show that the microstructure of brazed seam consists of intermetallic compounds such as( Ag,Cu),( Ni,Ti) and( Cu,Ni,Ti). The highest tensile strength of the joint is 182 MPa at the brazing temperature of 930 ℃ and the holding time of 10 min.

     

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