Co-Si钎料连接SiBCN陶瓷接头组织及力学性能

Microstructure and mechanical properties of Si BCN joints brazed by Co-Si filler

  • 摘要: 采用Co-Si钎料连接SiBCN陶瓷,其热膨胀系数(CTE)与SiBCN陶瓷相近。钎焊接头焊缝区域由Si+CoSi2共晶结构组成,没有明显的反应层,但在钎料和陶瓷基材之间建立了化学结合。后续试验中进一步尝试添加活性元素Zr以改善钎料在SiBCN陶瓷上的润湿性,但是Zr-Si化合物的出现显著降低了接头强度。而提高钎焊温度是改善Co-Si钎料润湿性的最好方法。接头的抗剪强度接近于母材的强度,最高抗剪强度为26 MPa。

     

    Abstract: Co-Si filler is used to join the Si BCN,the CTE of which is similar to each other. The joint is composed of Si + CoSi2 eutectic structure. There is no obvious reaction layer,but the chemical bond is established between the solder and the ceramic base material. The method of adding active element Zr is tried to improve the wettability,but the appearance of Zr-Si compounds can significantly reduce the strength of the joint. Therefore,increasing the brazing temperature is a good way to improve the wettability. The shear strength of the joint is close to the strength of the base metal. The highest shear strength is 26 MPa.

     

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