电真空器件用金银锗钎料研制

Development of Au-Ag-Ge solder for electric vacuum devices

  • 摘要: 研究了Au-Ag-Ge系列合金的熔化特性、加工性能以及钎焊性能。结果表明,在Au-12Ge合金中加入Ag元素,可以提高合金的熔化温度,但是仍不能满足使用要求。Au-52Ag-6Ge合金熔化温度为566~586℃,采用冷轧制+真空退火工艺可将合金加工制备为0.10 mm厚的带材,清洁性、溅散性和铺展性能良好,可以与AgCu28共晶钎料、AgCuIn钎料、AgCuInSn钎料形成四级梯度钎料,满足真空电子器件封接需求。

     

    Abstract: The melting characteristics,processability and solderability of Au-Ag-Ge solder were investigated. The result shows that Ag addition in Au-12 Ge alloy can increase melting temperature of the solder,but not enough to use. Au-52Ag-6Ge alloy with 566 ~ 586 ℃ melting temperature meets the requirements for use. Cold rolling and subsequently vacuum annealing process can be used to prepare 0. 10 mm thick strip material,and the composite solder has good cleanness,spatter and spread performance. The Au-52Ag-6Ge solder can form a quaternary gradient solder with AgCu28,Ag Cu In,and AgCuInSn solders to meet the needs of vacuum electronic devices.

     

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