• 中国科技核心期刊(中国科技论文统计源期刊)

助焊剂组成对SAC105锡膏铺展及焊后残留腐蚀的影响

吴家前, 孙福林, 张宇航, 林元华

吴家前, 孙福林, 张宇航, 林元华. 助焊剂组成对SAC105锡膏铺展及焊后残留腐蚀的影响[J]. 焊接, 2019, (8): 46-49. DOI: 10.12073/j.hj.20190306001
引用本文: 吴家前, 孙福林, 张宇航, 林元华. 助焊剂组成对SAC105锡膏铺展及焊后残留腐蚀的影响[J]. 焊接, 2019, (8): 46-49. DOI: 10.12073/j.hj.20190306001
WU Jiaqian, SUN Fulin, ZHANG Yuhang, LIN Yuanhua. Effects of compositions of flux on SAC105 solder paste spreading ratio and post-soldering residual corrosion[J]. WELDING & JOINING, 2019, (8): 46-49. DOI: 10.12073/j.hj.20190306001
Citation: WU Jiaqian, SUN Fulin, ZHANG Yuhang, LIN Yuanhua. Effects of compositions of flux on SAC105 solder paste spreading ratio and post-soldering residual corrosion[J]. WELDING & JOINING, 2019, (8): 46-49. DOI: 10.12073/j.hj.20190306001

助焊剂组成对SAC105锡膏铺展及焊后残留腐蚀的影响

基金项目: 

广东省科技计划项目(2014B070705007,2017B090901071)

广东省现代焊接技术重点实验室开放运行项目(2017B030314048)

广州市科技计划项目(201704030113)。

详细信息
    作者简介:

    吴家前,1989年出生,硕士;主要从事电子工业软钎焊方面的研究。

    通讯作者:

    张宇航,1980年出生,高级工程师

  • 中图分类号: TG425

Effects of compositions of flux on SAC105 solder paste spreading ratio and post-soldering residual corrosion

  • 摘要: 研究了助焊剂中活性剂、成膏体、酸碱调节剂对Sn1.0Ag0.5Cu (SAC105)锡膏铺展和焊后残留腐蚀的影响。结果表明,活性剂含量小于8%(质量分数)时,锡膏铺展率随活性剂含量的增加而增大,锡膏焊后SIR值随活性剂质量分数的提高而减小,活性剂含量为9%,焊后SIR值降至1.6×109Ω;成膏体为PEG2000复配改性环氧树脂A时,锡膏铺展率为81.4%,焊后残留腐蚀较少,焊后10天的SIR值基本稳定在1.5×1011Ω,成膏体为松香时,锡膏铺展率为82.6%,焊后10天的SIR值为4.0×109Ω;加入一定量的酸碱调节剂三乙醇胺能提高锡膏的铺展率、降低助焊剂pH值及焊后SIR值,当三乙醇胺含量为1.0%时,焊后SIR值最大,为1.6×1012Ω。
    Abstract: Effects of active agent,paste and acidity regulator of Sn1. 0 Ag0. 5 Cu solder paste flux on spreading ratio and post-soldering residual corrosion were studied. The results showed that the increase of active agent content is beneficial to the spreading ratio of solder paste when the content of active agent was below 8%( mass fraction,the same below). The post-soldering SIR value decreases as the content of active agent increased. The post-soldering SIR value decreased to 1. 6×109Ω at the content of active agent of 9%. The spreading ratio is 81. 4% and less post-soldering residual corrosion can be achieved when PEG2000 and modified epoxy resin was used as paste for the solder paste. The SIR value of this type of solder paste remains at 1. 5×1011Ω after soldering for 10 days. The spreading ratio is 82. 6% and the SIR value was 4. 0×109Ω when rosin was used as paste for the solder paste. The spreading ratio of the solder paste increases while the p H of flux and the postsoldering SIR value were decreased after triethanolamine being added as acidity regulator. The post-soldering SIR value reaches up to the maximum of 1.6×1012Ω at the content of triethanolamine of 1. 0%.
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出版历程
  • 收稿日期:  2019-03-05

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