7A52铝合金封接Al2O3陶瓷工艺

Sealing process of Al2O3 ceramic with 7A52 aluminum alloy

  • 摘要: 采用钎焊对7A52铝合金和直径φ10 mm表面镀镍的氧化铝陶瓷球进行封装,研究了加热温度和保温时间对显微组织特征、特征点成分和抗剪强度的影响。结果表明,采用硅镁焊料的7A52铝合金和Al2O3(Ni)陶瓷封接的最佳工艺参数:加热温度为590℃,压力2 MPa,保温时间1 h,反应层厚度在10~27 μm,接头达到的最大抗剪强度为24.8 MPa,接头界面结构为Al2O3陶瓷/Al-Ni金属间化合物/Al-Si共晶/7A52铝合金。

     

    Abstract: 7 A52 aluminum alloy and φ 10 mm nickel-plated alumina ceramic balls were encapsulated by brazing technology. Effects of heating temperature and holding time on microstructure characteristics,characteristic point composition and shear strength were studied. The results showed that optimum process parameters of 7 A52 aluminum alloy and Al2 O3( Ni) ceramic sealing with silicon-magnesium solder were 590 ℃heating temperature,2 MPa pressure and 1 h holding time. Thickness of the reaction layer was 10 ~ 27 μm,and maximum shear strength of the joint reached 24. 8 MPa. The interface structure of the joint was Al2O3 ceramic/Al-Ni intermetallic compound/Al-Si eutectic/7 A52 aluminum alloy.

     

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