Microstructure and properties of AgCuGa brazing filler metal
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摘要: 开发了一种银含量≤50%的新型Ag-Cu-Ga合金钎料，研究了Ag-Cu-Ga合金钎料的熔化特性、钎焊性能及接头的显微组织。结果表明，当Ag-Cu-Ga合金中Ga元素含量为5%时，其熔化温度为771～786 ℃，熔点适中，固液相温差较小。Ag-55Cu-5Ga合金铸态组织主要由富Cu相、富Ag相及Ag-Cu-Ga共晶相组成，这些塑性相为其提供了良好的加工性能。制备的0.1 mm带材清洁性、溅散性良好，在无氧铜、镍片上的铺展性能良好，在不锈钢上钎料有明显的收缩现象。搭接接头拉伸后在母材侧断裂，接头具有较高的强度。通过对接头界面组织分析，发现接头中形成了扩散层和大量的铜基固溶体及少量的细砂型共晶组织，扩散层及铜基固溶体从一定程度上提高了钎焊接头的强度。综合分析，Ag-55Cu-5Ga钎料是一种有望替代Ag-28Cu共晶钎料，满足真空电子器件封接需求。
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关键词:
- Ag-Cu-Ga合金 /
- 真空钎料 /
- 组织和性能
Abstract: A novel Ag-Cu-Ga（Ag≤50 wt. %） brazing filler metal was developed. The melting characteristics,brazing performance and microstructure of Ag-Cu-Ga brazing filler metal were investigated. The results indicated when the mass fraction of Ga in AG-Cu-GA alloy was 5%,its melting temperature was 771 ～ 786 ℃. The melting point was moderate and the temperature difference between solid and liquid phase was small.The as-cast microstructure of AG-55Cu-5GA alloy was mainly composed of rich Cu phase,rich Ag phase and Ag-Cu-Ga eutectic phase,which determined its good process ability. The Ag-55Cu-5Ga strip with a thickness of 0. 1 mm had optimal clean ability and collapsibility,which had good spreading performance on copper and nickel sheet,but had obvious shrinkage on stainless steel. The tensile samples of brazed joints failed in parent metal,and the strength of brazed joints was higher than that of parent metal. Through analysis of the interface microstructure,it was founded that diffusion layer,copper-based solid solution in large quantities and a small amount of fine sand eutectic microstructure were formed in the brazed joint,which improved tensile strength of the brazed joint to some extent. By comprehensive analysis,Ag-55Cu-5Ga brazing filler metal was probably a alternative to AgCu28 eutectic brazing filler metal to meet sealing requirements of the vacuum electronic device. -
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