平行间隙电阻焊微连接技术研究进展

Research progress on parallel gap resistance welding micro-connection technology

  • 摘要: 文中介绍了平行间隙电阻焊的连接机理,即主要依靠固相扩散实现界面的良好结合,同时对接触电阻的影响规律进行了讨论。重点介绍了线/片、片/片连接过程中温度场、应力-应变场的分布,并结合试验和模拟结果叙述了如焊接电压、焊接时间、电极压力、电极间距等焊接工艺参数对连接质量的影响。最后对平行间隙电阻焊的应用前景进行了展望,并对仿真研究的方向进行了探讨。

     

    Abstract: In this paper,the connection mechanism of parallel gap resistance welding was introduced,that is,good interface bonding was mainly achieved by solid phase diffusion,and the influence law of contact resistance was discussed. The distribution of temperature field and stress-strain field in the welding process of wire/sheet and sheet/sheet was emphatically introduced,and the influence of welding parameters such as welding voltage,welding time,electrode pressure and electrode spacing on the welding quality was described in combination with test and simulation results. Finally,the application prospect of parallel gap resistance welding was prospected,and the direction of simulation research was discussed.

     

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