触变剂加入温度及含量对焊锡膏印刷性能的影响

Effect of added temperature and content of thixotropic agent on printing properties of solder paste

摘要: 焊锡膏中触变剂可调节焊锡膏的粘度、触变指数及抗塌落性能，以提高焊锡膏的印刷性能。文中研究了触变剂加入温度，以及相同温度下触变剂含量对焊锡膏印刷性能的影响。试验结果表明，制备助焊剂时，在触变剂完全熔化合成的条件下，触变剂在熔点温度附近加入且含量为6～8%时，对应的焊锡膏印刷性能最好。

Abstract: Thixotropic agent in solder paste can adjust the viscosity,thixotropic index and anti-collapse performance of solder paste to improve the printing performance of solder paste. Effects of added temperature of thixotropic and contents of thixotropic at the same temperature on the printing properties of solder paste were studied. The results showed that in preparing soldering flux and under the condition of thixotropic agent completely melting synthesis,thixotropic agent was added near the melting point and the content was 6% ～ 8%,the corresponding solder paste printing performance was the best.