Effect of Ag and Zn on wettability of Sn58Bi solder and microstructure of soldered joint
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摘要: 采用感应熔炼方法制备钎料，研究了Ag，Zn元素添加对Sn58Bi钎料润湿性与焊点组织的影响，并对时效处理后的焊点界面金属间化合物(Intermetallic compounds, IMCs)的组成及生长规律进行了分析。结果表明，添加的Ag或Zn可与Sn分别生成Ag3Sn，Ag5Zn8，并可显著减少钎料中枝晶含量与细化钎料组织，但不能显著促进Sn58Bi钎料的润湿性。而共同添加的Ag，Zn并不能使得钎料组织发生细化并降低钎料的润湿性。共同添加的Ag和Zn使得焊点界面处形成Cu5Zn8+Ag8Zn5的复合IMCs层，该复合IMCs层可显著的减小IMCs的初始厚度，并降低其生长速度。Abstract: The solder was prepared by the induction melting method. The influence of Ag and Zn addition on the wettability of Sn58Bi solder and microstructure of soldered joint was studied. The composition and growth law of interface intermetallic compounds(IMCs) of the soldered joint after aging treatment were analyzed. The results showed that the added Ag or Zn could respectively produce Ag3Sn and Ag8Zn5 with Sn,significantly reduce the content of dendrites in the solder and refine microstructure of solders, but not significantly promote the wettability of Sn58Bi solder. However, the added Ag together with Zn could not refine microstructure of solders or reduce the the wettability of solders. The added Ag together with Zn made a composite IMC layer formed by Cu5Zn8+Ag8Zn5 at the interface of soldered joint. The composite IMC layer could significantly reduce the initial thickness of the IMC and reduce its growth rate.
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Keywords:
- Sn58Bi /
- lead-free solder /
- wettability /
- microstructure
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期刊类型引用(2)
1. 姜艳，何云龙，李楠，罗庭碧，杨东. Pr对Sn58Bi钎料微观组织和性能的影响. 焊接. 2022(02): 56-59 . 
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2. 马一鸣，储继君，吕晓春，孙凤莲. Ag, Sb对时效处理的Sn58Bi钎料组织及硬度影响. 机械制造文摘(焊接分册). 2021(04): 1-4+16 . 百度学术
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