Sn-0.7Cu-xNb复合钎料微观组织和力学性能

Microstructure and mechanical properties of Sn-0.7Cu-xNb composite solder

  • 摘要: 文中主要研究了纳米Nb颗粒对Sn-0.7Cu基复合钎料显微组织和力学性能的影响。结果表明,添加纳米Nb颗粒细化了Sn-0.7Cu复合钎料微观组织,提高了Sn-0.7Cu复合钎料的抗拉强度。当Nb含量为0.12%时抗拉强度达最大值25.36 MPa,但此时钎料的断后伸长率有所降低。Sn-0.7Cu-xNb复合钎料的断裂模式均为塑性断裂,随Nb含量的增加,Sn-0.7Cu基复合钎料断口表面的韧窝尺寸逐渐变小,表明微量的纳米Nb可以抑制合金内Cu6Sn5金属间化合物的长大。

     

    Abstract: The effect of Nb nano-particles on the microstructures and mechanical properties of Sn-0.7Cu composite solder was studied in this paper.The results showed that the microstructure of Sn-0.7Cu composite solder was refined by adding Nb nano-particles and the tensile strength of joint with Sn-0.7Cu composite solder was improved.When Nb content was 0.12%(mass fraction),the maximum tensile strength reached 25.36 MPa,but the elongation of the solder was reduced.The fracture mode of Sn-0.7Cu-xNb composite solder was all plastic fracture.The size of dimples on the fracture surface of Sn-0.7Cu composite solder decreased gradually with the increase of Nb content,which indicated that the growth of Cu6Sn5 intermetallic was inhibited by adding a small amount of Nb nano-particles.

     

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