镀镍覆铜基板激光阻焊工艺特性

Characteristics of laser solder mask on nickel-plated copper-clad substrate

  • 摘要: 为避免镀镍覆铜基板上近距离元器件焊接过程中出现桥连、偏转等缺陷,提高焊接可靠性,采用激光光束在镍层上刻蚀的方法进行阻焊工艺开发。通过正交试验对激光参数进行选取和优化,结果表明,当激光脉冲电流为14 A、调制频率为5 000 Hz、激光步距为0.4时,可以获得较好的阻焊效果,进一步对阻焊图形进行设计优化,最终确定阻焊区宽度小于100 μm,大大提升了元器件贴装及焊接密度。

     

    Abstract: In order to avoid bridging, deflection and other defects in welding process of close-range components on nickel-plated copper-clad substrates, and to improve welding reliability, the method of laser beam etching on the nickel layer was used to develop the solder mask process. The laser parameters were selected and optimized through orthogonal experiments. The results showed that when the laser pulse current was 14 A, the modulation frequency was 5. 0 kHz, and the laser step was 0. 4, a good solder mask effect could be obtained. The solder mask pattern was further designed and optimized, and finally determined that the width of the solder mask area was less than 100 μm, which greatly improved the component placement and soldering density.

     

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