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界面Ni3Sn4微观形貌演变对微焊点力学性能的影响

邱超, 苏鹏, 秦建峰, 马玉琳, 任宁

邱超, 苏鹏, 秦建峰, 马玉琳, 任宁. 界面Ni3Sn4微观形貌演变对微焊点力学性能的影响[J]. 焊接, 2022, (3). DOI: 10.12073/j.hj.20211117002
引用本文: 邱超, 苏鹏, 秦建峰, 马玉琳, 任宁. 界面Ni3Sn4微观形貌演变对微焊点力学性能的影响[J]. 焊接, 2022, (3). DOI: 10.12073/j.hj.20211117002
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Qiu Chao, Su Peng, Qin Jianfeng, Ma Yulin, Ren Ning. Effect of interfacial Ni3Sn4 micro morphology evolution on mechanical properties of micro solder joints[J]. WELDING & JOINING, 2022, (3). DOI: 10.12073/j.hj.20211117002
Citation: Qiu Chao, Su Peng, Qin Jianfeng, Ma Yulin, Ren Ning. Effect of interfacial Ni3Sn4 micro morphology evolution on mechanical properties of micro solder joints[J]. WELDING & JOINING, 2022, (3). DOI: 10.12073/j.hj.20211117002
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界面Ni3Sn4微观形貌演变对微焊点力学性能的影响

Effect of interfacial Ni3Sn4 micro morphology evolution on mechanical properties of micro solder joints

摘要

    摘要
  • 摘要: 针对Ni/(20 μm)Sn/Ni微焊点，研究界面金属间化合物(IMC)Ni3Sn4微观形貌演变及其对微焊点力学性能的影响，并对拉伸断口进行分析。结果表明，随着回流时间增加，Ni3Sn4 IMC厚度快速增加，其形貌也发生显著变化，由短棒状转变成长棒状，最后演变成块状；微焊点的抗拉强度表现为先减小、再持续增大的反常变化趋势，界面Ni3Sn4微观形貌演变成为主导因素，转变成长棒状的Ni3Sn4引起应力集中，造成微焊点的强度降低，继续转变成的块状Ni3Sn4增加了裂纹抗力，提高了抗拉强度。微焊点的断口形貌进一步证实了Ni3Sn4微观形貌演变对微焊点力学性能影响。创新点： 以互连高度为20 μm的Ni/Sn/Ni微焊点为研究对象，通过控制延长回流时间形成以Ni3Sn4 IMC为唯一变量实现其生长的方法，研究了Ni3Sn4 IMC的微观形貌演变对微焊点抗拉强度的影响。
    Abstract: For Ni/(20 μm)The microstructure evolution of interfacial intermetallic compound(IMC)Ni3Sn4 and its effect on the mechanical properties of Sn/Ni micro solder joints were studied, and the tensile fracture was analyzed.The results showed that with the increase of reflux time, the thickness of Ni3Sn4 IMC increased rapidly, and its morphology also changed significantly, from short rod to long rod, and finally to block.The tensile strength of micro solder joints showed an abnormal trend of decreasing first and then increasing continuously.The micro morphology of interface Ni3Sn4 had evolved into the dominant factor.The transformation of long rod Ni3Sn4 caused stress concentration and reduced the strength of micro solder joints.The continuous transformation of massive Ni3Sn4 increased the crack resistance and improved the tensile strength.The fracture morphology of micro solder joints further confirmed the influence of Ni3Sn4 micro morphology evolution on the mechanical properties of micro solder joints.Highlights: Taking Ni/Sn/Ni micro solder joints with 20 μm interconnection height as the research object, a method was developed to achieve micro solder joints’ growth with Ni3Sn4 IMC as the only variable by controlling and extending the reflow time.The influence of microstructure evolution of Ni3Sn4 IMC on tensile strength of micro solder joints was studied.
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    • 参考文献(20)
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出版历程
  • 收稿日期:  2021-11-16
  • 修回日期:  2021-12-01
  • 发布日期:  2022-03-24

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