Ni含量对In-48Sn钎料焊点显微组织和剪切性能的影响

Effect of Ni content on microstructure and shear properties of In-48Sn solder joints

摘要: 研究了Ni含量对In-48Sn钎料焊点的显微组织与剪切性能的影响。结果表明，Ni颗粒可抑制界面IMC的生长，细化焊缝组织，随着Ni含量的增加，界面IMC的厚度由4.01 μm逐渐减小到2.83 μm，In48Sn-45Ni复合钎料焊点组织最为细小；Ni颗粒可提高In-48Sn钎料焊点的抗剪强度，复合钎料焊点的抗剪强度随Ni含量的增加呈先上升后下降的趋势。当Ni的质量分数为45%时，由于Ni颗粒对位错的阻碍、对组织的细化并且界面IMC达到合适厚度，抗剪强度达到峰值9.76 MPa。

Abstract: Effect of Ni content on microstructure and shear properties of In-48Sn solder joints was studied. The results showed that Ni particles could inhibit growth of interfacial IMC and refine microstructure of weld. With the increase of Ni content, thickness of interfacial IMC gradually decreased from 4.01 μm to 2.83 μm, and microstructure of In48Sn-45Ni composite solder joint was the finest. Ni particles could improve shear strength of In-48Sn solder joints, and shear strength of composite solder joints increased first and then decreased with the increase of Ni content. When mass fraction of Ni was 45%, shear strength reached a peak of 9.76 MPa due to Ni particles hindering dislocations and refining tissues, as well as interfacial IMC reaching appropriate thickness.