Abstract: In order to fully understand the change rule of comprehensive properties about component of BAg30CuxZny solder (such as melting temperature, wettability and spreadability, mechanical properties, and electrical properties), the experimental study on electrical properties of the copper and silver joints with BAg30CuxZny brazing filler metal were carried out. In order to better represent the changes of the electrical properties of brazed joints, the temperature rise of joint is selected as the comparison object because of it is an evaluation project in the electrical industry.The existing research shows that the joint brazed rate directly affects the size of temperature rise, that is to say, the more brazing rate is low, the more temperature appreciation is high, so the brazed rate influence factors in the experiment was shielded, and the tested brazed joint should have the similar brazing rate (+ 0.5%). Through the comparative analysis of microstructure, the internal factors that affect the appreciation of temperature were deduced.