C<sub>f</sub>/C复合材料与纯铜的胶接辅助钎焊连接

C_f/C复合材料与纯铜的胶接辅助钎焊连接

摘要: 采用胶接辅助钎焊方法，以TiH₂粉为活性元素源，环氧树脂为粘性载体，Ag-Cu共晶合金为钎料，Cu箔为应力缓冲层材料，实现了C_f/C复合材料与纯铜的钎焊连接，结果表明，接头界面处产生TiC, TiCu, Ag(s, s), Cu(s, s)等反应产物，其结构可表示为(C_f/C)/TiC+Ag(s, s)+Cu(s, s)+TiCu/Cu。通过钎焊工艺试验得出，在930 ℃保温25 min钎焊条件下接头的抗剪强度达到最大值30 MPa。

Abstract: C_f/C composites was bonded with copper effectively through active cement added brazing process using TiH₂ power for active element, epoxy resin for stickiness, Ag-Cu eutectic alloy for filler metal, and copper foil for interlayer. The results show that four reaction products generated in the brazed joint, namely as TiC, TiCu, Ag（ s,s） and Cu（ s, s）. The interfacial microstructure of joint can be described as（C_f/C）/TiC + Ag（ s,s） + Cu（ s,s） + TiCu/Cu. The maximum shear strength is 30 MPa for the joint brazed at 930℃ for 25 minutes.