Development of Au-Ag-Ge solder for electric vacuum devices

The melting characteristics,processability and solderability of Au-Ag-Ge solder were investigated. The result shows that Ag addition in Au-12 Ge alloy can increase melting temperature of the solder,but not enough to use. Au-52Ag-6Ge alloy with 566 ～ 586 ℃ melting temperature meets the requirements for use. Cold rolling and subsequently vacuum annealing process can be used to prepare 0. 10 mm thick strip material,and the composite solder has good cleanness,spatter and spread performance. The Au-52Ag-6Ge solder can form a quaternary gradient solder with AgCu28,Ag Cu In,and AgCuInSn solders to meet the needs of vacuum electronic devices.