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LIU Zheng, ZHANG Yaocheng, XU Yuhang, LIU Po. Microstructure and mechanical properties of Sn-0.7Cu-xNb composite solder[J]. WELDING & JOINING, 2021, (1): 24-27,60. DOI: 10.12073/j.hj.20201115001
Citation: LIU Zheng, ZHANG Yaocheng, XU Yuhang, LIU Po. Microstructure and mechanical properties of Sn-0.7Cu-xNb composite solder[J]. WELDING & JOINING, 2021, (1): 24-27,60. DOI: 10.12073/j.hj.20201115001
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Microstructure and mechanical properties of Sn-0.7Cu-xNb composite solder

  • 1. Guilin University of Aerospace Technology, Glin 541004;

  • 2. Changshu Institute of Technology, Changshu 215500, Jiangsu, China

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  • Received Date: November 14, 2020
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    • Abstract
  • The effect of Nb nano-particles on the microstructures and mechanical properties of Sn-0.7Cu composite solder was studied in this paper.The results showed that the microstructure of Sn-0.7Cu composite solder was refined by adding Nb nano-particles and the tensile strength of joint with Sn-0.7Cu composite solder was improved.When Nb content was 0.12%（mass fraction）,the maximum tensile strength reached 25.36 MPa,but the elongation of the solder was reduced.The fracture mode of Sn-0.7Cu-xNb composite solder was all plastic fracture.The size of dimples on the fracture surface of Sn-0.7Cu composite solder decreased gradually with the increase of Nb content,which indicated that the growth of Cu6Sn5 intermetallic was inhibited by adding a small amount of Nb nano-particles.
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    • References (14)
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