Research progress on reliability of lead-free soldered joints

Based on the problems existing in the research and development of lead-free solders in China in recent two years, research progress and development trend of lead-free solders was briefly reviewed in this paper, and the lead-free solders focusing on the reliability of soldered joints was reviewed. Factors affecting the reliability of lead-free solder joints were firstly introduced in this paper. Research methods and achievements of domestic scholars on the reliability of lead-free solder joints from 2012 ～ 2018 year were secondly collected. Reliability of leadfree soldered joints was analyzed from four aspects that affected performance of lead-free soldered, namely joints loading and thermal cycling,finite element simulation, electrical migration and tin whisker growth. Based on the above research results, the future development of lead-free solders was finally prospected, which provided theoretical support for further research of new lead-free solders.