Predictive analysis of shear strength of soldered joints of chip components based on grey correlation and quantitative model

Objective An experimental study of soldering process and maximum shear strength of soldered joints was carried out for surface-mounted resistive components, and a gray correlation and quantization model was used to predict strength of soldered joints based on experimental data. Methods To this end, corresponding shear properties of soldered joints were obtained by push-off force test of soldered joints of component. 36 groups of incomplete orthogonal tests of soldering parameters combinations were designed to analyze effects of soldering parameters such as amount of solder paste coating, placement pressure, welding time, welding temperature and device mounting accuracy on shear strength. Grey correlation analysis and regression model prediction were carried out on the test values. The quantitative relationship between different soldering parameters and the maximum shear strength was described accurately. Results The results showed that welding heating temperature of chip components had the greatest influence on the maximum shear strength of soldered joints of chip components with a gray correlation degree of 0.759, while device placement accuracy had the least influence with a gray correlation degree of 0.734. Conclusions In the study, through combination of experimental and regression prediction models, quantitative relationship between soldering parameters and soldering quality can be accurately described.