Microstructure and mechanical properties of Cu/Sn-58Bi-xEr2O3/Cu brazed joint

The effect of minute nano-Er2O3particles on the wettability, microstructure and mechanical properties of Sn-58Bi solder was investigated. The results revealed that the microstructure of the solder is refined, the spreadability and mechanical properties of the composite solder are also improved with the addition of nano-Er2O3particles. When the addition of nano-Er2O3particles is 0.075wt.%, the best spreading performance can be obtained and its spreading coefficient increases by 5.1% compared with plain Sn-58Bi solder. In addition, when the addition of nano-Er2O3particles is 0.05wt.%, the microstructure of the solder is refined and the maximum tensile strength of the composite solder is 89 MPa, whose tensile strength increases by 11% compared with the plain Sn-58Bi solder.