• 中国科技核心期刊(中国科技论文统计源期刊)

SAC105钎料用无卤素助焊剂活性剂的选择

林雨生, 戴宗倍, 刘凤美, 车欣, 易江龙

林雨生, 戴宗倍, 刘凤美, 车欣, 易江龙. SAC105钎料用无卤素助焊剂活性剂的选择[J]. 焊接, 2019, (2): 26-30. DOI: 10.12073/j.hj.20181024001
引用本文: 林雨生, 戴宗倍, 刘凤美, 车欣, 易江龙. SAC105钎料用无卤素助焊剂活性剂的选择[J]. 焊接, 2019, (2): 26-30. DOI: 10.12073/j.hj.20181024001
LIN Yusheng, DAI Zongbei, LIU Fengmei, CHE Xin, YI Jianglong. Selection of activating flux in halogen-free flux used for SAC105 solder[J]. WELDING & JOINING, 2019, (2): 26-30. DOI: 10.12073/j.hj.20181024001
Citation: LIN Yusheng, DAI Zongbei, LIU Fengmei, CHE Xin, YI Jianglong. Selection of activating flux in halogen-free flux used for SAC105 solder[J]. WELDING & JOINING, 2019, (2): 26-30. DOI: 10.12073/j.hj.20181024001

SAC105钎料用无卤素助焊剂活性剂的选择

基金项目: 

国家重点研发计划(2017YFB0305700)

广州市科技计划项目(201807010029)

广东省科学院实施创新驱动发展能力建设专项资金项目(2018GDASCX-0113).

详细信息
    作者简介:

    林雨生,1995年出生,硕士;主要研究领域为电子封装可靠性。

    通讯作者:

    戴宗倍,1989年出生,博士,工程师

  • 中图分类号: TG425

Selection of activating flux in halogen-free flux used for SAC105 solder

  • 摘要: 选用弱有机酸—乙醇酸和邻苯二甲酸作为活性剂,制备出无卤素松香基助焊剂,用于低银钎料Sn-1.0Ag-0.5Cu (SAC105)/Cu的钎焊。文中考察了弱有机酸的含量及其复配比例对焊接性、铺展率及电气稳定性的影响,发现当有机酸的质量分数为4%,乙醇酸和邻苯二甲酸质量比1∶1时,能够满足SAC105钎料对焊接性及铺展能力的要求,且通过表面绝缘电阻试验结果,发现所研制的助焊剂焊后残留少,具备很好的电气稳定性,能够有效避免潮热环境下的离子迁移失效。结果表明,乙醇酸和邻苯二甲酸具备作为商用助焊剂活性剂的潜力。
    Abstract: Glycolic acid and phthalic acid were used as weak organic acid activators of halogen-free rosin-based flux that was utilized to solder low silver content SAC105 solder on Cu substrate. The influence of activators content and the corresponding proportional ratio of glycolic acid and phthalic acid on the solderability,spreading rate and electronic stability was studied. It is found that,the adequate solderability and spreading rate of SAC105/Cu can be achieved by using the designed flux with 4 wt. % of weak organic acids consisted of glycolic acid and phthalic acid with a proportional ratio of 1∶ 1. In addition,by using aforesaid flux,very few residues are left with strong electronic stability via the evaluation of surface insulation resistance,which indicates the failure due to ionic migration under hygrothermal condition can be avoided. Therefore,glycolic acid and phthalic acid have the potential for commercial use in soldering flux.
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出版历程
  • 收稿日期:  2018-10-23

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