Effect of trace silicon on properties of Cu-P-Sn powdery brazing filler metal
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摘要: 采用气水耦合雾化法制备了铜磷锡粉状钎料,并通过添加质量分数为0.5%的硅元素改善粉末球形度和粒度分布,通过粉体材料综合测试仪、比表面积仪、激光粒度仪及差热分析仪检测了两种粉状钎料的基本性能,使用制得的粉状钎料进行火焰钎焊制备拉伸试样,通过力学试验机测试焊缝抗拉强度,通过电子显微镜分析了两种粉状钎料微观形貌及焊缝的微观组织。结果表明,微量硅元素可改善铜磷锡粉末的综合性能,其中松装密度提高17%,振实密度提高15%,比表面积提高60%,粉末粒径由42.93 μm降至30.88 μm,合金粉末熔点降低6℃;微量硅元素可显著提高铜磷锡粉状钎料的球形度,钎缝中形成尺寸较大的胞状α铜基固溶体,硅元素扩散进入基体中,接头抗拉强度略有提升。Abstract: Cu-P-Sn powdery brazing filler metal was prepared by gas-water coupling atomization method,the sphericity andsize distribution were improved by adding 0. 5% mass fraction silicon. The basic properties of two kinds of powdery brazing filler metal were tested by powder material comprehensive tester,specific surface area tester,laser particle size tester and differential thermal analysis tester. The tensile specimen was prepared by flame brazing with the prepared powder filler. The tensile strength of weld was tested by mechanical testing machine. The micromorphology and microstructure of two kinds of powdery brazing filler metal were analyzed by electron microscope. The results showed that trace silicon could improve the comprehensive properties of Cu-P-Sn powders. The bulk density was increased by 17%,the compaction density by 15%,and the specific surface area by 60%. The particle size was reduced from 42. 93 to 30. 88 micron,and the melting point of alloy powder was decreased by 6 ℃ . The sphericity of Cu-P-Sn powdery brazing filler metal could be significantly improved by trace silicon element. A larger cellular alpha-Cu-based solid solution formed in brazing seam and silicon element diffused into the matrix,which slightly improved the tensile strength of the joint.
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Keywords:
- Cu-P-Sn powdery brazing filler metal /
- silicon element /
- sphericity /
- strength
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