面接触的旋转圆柱电极直径对电火花沉积层形貌的影响

Effect of surface contact diameter of rotating cylindrical electrode on deposition layer morphology of electric-spark deposition

  • 摘要:
    目的 旨在研究面接触状态下电火花沉积(Electric-spark deposition,ESD)的放电和材料转移机理。
    方法 采用不同直径的圆柱电极进行电火花自动沉积试验,分析不同直径的电极电火花沉积过程的转移效率、沉积效率、放电波形、沉积层的表面形貌和截面形貌、表面粗糙度等。
    结果 结果表明,圆柱电极与工件表面垂直进行电火花沉积时,随着电极直径的增大,转移效率和沉积效率增大,沉积层的表面粗糙度也随之增大。电极直径超过限定值时,转移效率、沉积效率和沉积层的表面粗糙度呈下降趋势。电极直径小于4 mm时,可获得均匀的沉积层;当电极直径超过5 mm时,放电和沉积主要集中在工件表面的局部区域,从而形成厚度不均匀的沉积层。
    结论 电极直径的增大导致电极端面与工件表面之间接触面积的增大和接触点的增多,降低了沉积过程中各接触点的放电电流密度,影响了材料转移过程,并使火花和飞溅减少。

     

    Abstract: Objective The aim is to study the discharge mechanism and material transfer mechanism of electric-spark deposition (ESD) in surface contact state. Methods The automatic ESD experiments are carried out with different cylindrical electrode diameters. The transfer efficiency, deposition efficiency, discharge waveform of ESD and surface morphology, cross-section morphology, surface roughness of the deposition layer are analyzed in different electrode diameters. Results The results show that the transfer efficiency and deposition efficiency increase with the increase of electrode diameter, and the surface roughness of deposition layer also increases accordingly when the cylindrical electrode is deposited vertically with the workpiece surface. When the electrode diameter exceeds a certain value, both transfer efficiency and deposition efficiency as well as surface roughness exhibit a decreasing trend. A uniform deposition layer can be obtained when the electrode diameter is less than 4 mm, however, when the electrode diameter is more than 5 mm, the discharge and deposition are mainly concentrated on localized area of workpiece surface leading to an uneven thickness in the deposition layer. Conclusion The increase of electrode diameter results in the increase of contact area between electrode end face and workpiece surface and the increase of contact points, which reduces the discharge current density at each contact point during the deposition process, affects the material transfer process and reduces the sparks and splatters.

     

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