磁热协同高密度深孔插装焊点数值仿真与互连工艺

Numerical simulation and interconnection of high-density deep hole solder joints based on magnetothermal synergy

  • 摘要:
    目的 旨在解决高密度微细深孔插装焊点互连中存在的桥连、透锡率不足及空洞率等难题。
    方法 基于COMSOL Multiphysics平台构建2.54 mm间距磁−热耦合模型,系统研究焊接时间与引脚长度对磁场强度及温度场的影响,优化软钎焊工艺参数。
    结果 结果表明,焊接时间对温度场调控显著,当焊接时间增至10 s时,焊点温度达300 ℃;通过分析Sn63Pb37钎料最佳软钎焊温度区间(210~230 ℃),发现5 s加热周期可使焊点上下侧均处于理想温度区间,实现钎料充分润湿填充,同时邻近焊点温度低于100 ℃,有效避免二次重熔引发的桥连缺陷。引脚长度对温度场影响较小,但其尺寸增大会压缩铁氧体安装空间,导致磁结构偏移。参数扫描显示目标焊点上下侧磁场强度分别稳定在0.045 T和0.030 T,较邻近焊点高2个量级。
    结论 聚焦感应加热法在磁场精准控制方面的技术优势为高密度微细焊点互连提供了有效解决方案。

     

    Abstract: Objective The aim is to address challenges of bridging, insufficient solder fill rate and void formation in the interconnection of high-density micro-deep hole solder joints. Methods A magnetic-thermal coupling model with 2.54 mm pitch is developed on the COMSOL Multiphysics platform to systematically investigate effects of soldering time and pin length on magnetic field intensity and temperature distribution, with the aim of optimizing soldering parameters. Results The results demonstrates that soldering time significantly governs temperature regulation. When heating duration increases to 10 s, temperature of solder joints reaches 300 °C. By analyzing the optimal soldering temperature window (210~230 °C) for Sn63Pb37 solder, a 5 s heating cycle is identified to maintain both upper and lower regions of solder joints within the ideal temperature range, ensuring complete solder wetting and cavity filling. Concurrently, temperature of adjacent solder joints remains below 100 °C, effectively preventing bridging defects caused by secondary reflow. Pin length exhibits limited influence on temperature field, yet its dimensional increase reduces ferrite core installation space, inducing magnetic structure misalignment. Parameter scanning shows that magnetic field intensity at the upper and lower regions of target joints is stable at 0.045 T and 0.030 T, respectively, surpassing adjacent joints by two orders of magnitude. Conclusion Technical superiority of focused induction heating in precise magnetic field control offers an effective solution for interconnection of high-density micro-scale solder joints.

     

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