Sn含量对Ag-Cu-In合金钎料加工及钎焊性能的影响
Influence of Sn concentration on processability and solderability of Ag-Cu-In alloys
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摘要: 研究了Sn元素对Ag-Cu-In合金钎料加工及钎焊性能的影响。结果表明:Ag-Cu-In合金钎料中加入一定量的可以有效降低钎料的熔化温度,当8%Sn元素加入Ag-Cu-In合金中,其熔化温度降低为575~620 ℃,可以加工为0.10 mm厚的带材,钎焊性能良好;随着合金中Sn元素含量的增加,合金钎料中的脆性相增多、变大,导致合金的加工性能变差,不能成型。
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关键词:
- Ag-Cu-In-Sn合金 /
- 钎料 /
- 钎焊 /
- 加工性能
Abstract: The influence of Sn concentration on processability and solderability of Ag-Cu-In alloys were investigated. The result shows that Sn addition in Ag-Cu-In alloys can effectively reduced the melting temperature of the solder. When the alloy with 8% Sn concentration, the melting temperature is 575~620 ℃, the composite solder can be processed into strip, the trip with thickness of 0.1 mm,and the composite solder has good welding performance. However with Sn concentration increasing, when the Sn concentration is more than 8%, excessive Sn addition promotes formation of the coarse second phase particles, which results in the deterioration of processability.-
Keywords:
- Ag-Cu-In-Sn alloy /
- solder /
- braze /
- machinability
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[1] 刘联保,杨钰平,柯春和,等.陶瓷-金属封接技术指南[M]. 北京:国防工业出版社,1990. [2] 张玉奎.银基钎料发展概况[J]. 有色金属与稀土应用,1999,12(1):1-6. [3] 孙 鹏,唐 宏. 电子战武器装备发展现状与展望[J].电讯技术,2008(3):7-11. [4] 罗 群.军事电子先进制造技术发展战略分析[J].现代雷达,2007(8):7-11. [5] 窦新玉.系统集成封装技术[J].电子工业专用设备,2005(5):1-4. [6] 何中伟,王守政.LTCC基板与封装的一体化制造[J].电子与封装,2004(4):20-23. [7] 张 霓. 微电子组件封装和封接技术的分析和最新进展[J]. 混合微电子技术,1999(4):18-22. [8] 刘泽光,王文祥,唐 敏,等. Ag-Cu-In-Sn系低熔点钎料[J]. 贵金属,1991,12(3):17-21. [9] 刘泽光. Ag-Cu-In-Sn合金的结构特性[J]. 贵金属,1992(2):29-33. [10] 石 磊,周 飞,崔 良,等.元素In对Ag60Cu合金钎料组织和性能的影响[J]. 焊接,2014(12):32-36. [11] 王星星,龙伟民,朱 坤,等.化学镀锡层对BAg35CuZnSn钎料润湿性的影响[J]. 焊接,2014(9):32-35. [12] 孙瑞涛,张国清,齐岳峰,等.AgCuSn-Ag-AgCuSn复合钎料的组织及性能[J]. 焊接,2016(3):59-61.
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