BGA to tin-lead solder ball in avionics product
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摘要: 研究了焊膏法植球和助焊剂法植球两种焊接工艺方法对航空产品用无铅BGA器件有铅植球焊接质量的影响。X射线检测结果表明，通过焊膏法与助焊剂法两种植球工艺均可以获得外形规整、一致性高的焊球；焊接界面显微组织分析结果表明，助焊剂法植球的焊接界面金属间化合物层的平均厚度与焊膏法植球相比，增加了约49%，达到1.81 μm；焊膏法和助焊剂法两种植球工艺的焊球抗剪切力分别为11.89 N和11.40 N，建议使用焊膏法进行植球。Abstract: Effects of different soldering-ball process（ including paste soldering and flux soldering） on the quality of converting lead-free BGA to tin-lead device were studied. The X-ray inspection results show that the soldered balls made of paste soldering and flux soldering have a regular and homogeneous shape. The microstructure analyses results show that the thickness of intermetallic compounds layer between Cu-pad and soldered ball using flux soldering is 1. 81 μm,which is 49% higher than that of paste soldering. The mechanical properties test results indicate that the shear force of the soldered joint by paste soldering and flux soldering are 11. 86 N and 11. 40 N,respectively. Paste soldering is recommended for the soldering-ball process of avionics product.
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Keywords:
- ball grid array /
- soldering-ball /
- microstructure /
- mechanical property
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