Effect of aging temperature on reliability of soldered joint with Sn-0.7Cu-xFe filler metal
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摘要: 研究了时效温度对钎料Sn-0.7Cu及Sn-0.7Cu-0.05Fe钎焊接头微观组织和接头拉伸强度及断口形貌的影响规律。结果表明:随着时效温度提高,焊点组织粗化,钎料中Cu6Sn5化合物形貌由针状向棒状转变,且长大趋势较明显,Fe颗粒的添加可以延缓时效过程中Sn-0.7Cu-x Fe接头微观组织中Cu6Sn5的粗化程度;钎焊接头抗拉强度随着时效温度提高呈现下降趋势,且在相同时效温度下钎料Sn-0.7Cu-0.05Fe钎焊接头抗拉强度均高于Sn-0.7Cu;随着时效温度提高,Sn-0.7Cu和Sn-0.7Cu-0.05Fe钎料钎焊接头断口形貌主要由韧窝和河流解理花样组成,接头的断裂机制随时效温度的升高由塑性断裂逐渐转变为脆性断裂。Abstract: The effects of aging temperature on the tensile strength, fracture morphology and microstructures of soldered joints with Sn-0.7Cu and Sn-0.7Cu-0.05Fe filler metals were investigated. The results show that the morphology of Cu6Sn5 compound in the solder is changed from needle-shape to rod-shape with the increase of aging temperature. The addition of Fe particles can decrease the coarsening degree of Cu6Sn5 in the microstructure of joint with Sn-0.7Cu-xFe solder during the aging process. The tensile strength of soldered joint with Sn-0.7Cu-0.05Fe solder is higher than that with Sn-0.7Cu solder at the same aging temperature. The fracture of joints with Sn-0.7Cu and Sn-0.7Cu-0.05Fe solders are mainly composed of dimple and river cleavage pattern. The fracture mechanism of the joint is changed from plastic fracture to brittle fracture during the range of the aging temperature.
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Keywords:
- soldered joint /
- aging temperature /
- microstructure /
- tensile strength
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